PTING Intelligent Blasting Machine - Semiconductor target industry applications

What is semiconductor target? Targets include ITO, molybdenum, copper, aluminium, silicon, titanium, tantalum and various types of alloys and rare metal targets, the product form structure is divided into plane, rotating target. Coated target is through magnetron sputtering, multi-arc ion plating or other types of coating system in the appropriate process conditions sputtering on the substrate to form a variety of functional thin film sputtering source. Simply put, the target is a high-speed energy-charged particle bombardment of the target material, used in high-energy laser weapons, different power densities, different output waveforms, different wavelengths of laser light and different target interaction, will produce different killing and destructive effects. For example: evaporation magnetron sputtering coating is heated evaporation coating, aluminium film and so on. Replacement of different target materials (such as aluminium, copper, stainless steel, titanium, nickel target, etc.), you can get different film systems (such as super-hard, wear-resistant, corrosion-resistant alloy film, etc.).

The target material sandblasting and fusion blasting process, a method of treating a target material, comprising: providing a target material, said target material comprising a non-sputtering zone in an edge region; sandblasting the surface of said non-sputtering zone of said target material to form a rough surface; and fusion blasting said rough surface to form a film layer on the surface of said non-sputtering zone. After the sandblasting treatment, a rough surface is formed on the surface of the non-sputtering zone of the target material; next, the rough surface is subjected to the fusion treatment to form a film layer, and due to the unevenness of the rough surface, the melted powder can easily land on the rough surface without rolling off. The film layer formed on the surface of the non-sputtering area after the sandblasting and fusion injection treatment has a strong adhesion to the surface of the non-sputtering area compared to the simple sandblasting treatment. When the target of the present technical solution is applied to vacuum sputtering for a longer period of time, the film layer will not come off even if the target atoms form a build-up, keeping the sputtering parameters stable. Moreover, this significantly improves the service life of the target material, ultimately increasing the life of the target material by more than 50%.

The process of sand blasting equipment requirements are extremely high: first, the need for robots or sand blasting robots on the workpiece for precise sand blasting cleaning and coverage, cleanliness, coverage, roughness to maintain consistent and uniform; second, the need to apply various types of ultra-fine abrasives, sand blasting equipment, the stability of the requirements of the very high, and the third is the high requirements of environmental protection, the equipment control system must be a comprehensive data-based, intelligent.


PTING technology for the semiconductor target industry specially developed series of robotic intelligent sand blasting machine for the semiconductor target industry to provide a complete localised equipment and process technology solutions, no longer rely on Japan, Korea, Europe and the United States of America's technology and equipment.








Semiconductor special equipment belongs to the semiconductor industry chain support links, PTING Technology will be deep ploughing, continuous innovation and research and development, for China's semiconductor industry to provide first-class equipment and technology to contribute.