Surfaces of aluminium oxide, white oxide, aluminium nitride, boron carbide and silicon oxide glass are cleaned and removed by sandblasting, with a removal volume of 10-15 microns and a surface roughness of 0.8-1.2 microns, while ensuring a high degree of consistency.
Semiconductor material surface sandblasting removal, cutting and grinding and high-precision engraving technology in the country has always been a ‘neck’ technology, the realization of the process of equipment requirements are extremely high. PATTING Technology has recently achieved a major breakthrough in this technology.
Successively for XD, JC, WYS and the United States and other semiconductor customers to provide the sand blasting process equipment solutions, sand blasting equipment and processes in the industry for in-depth development and research, to solve the gun in the ultra-low-pressure sand blasting of uniform sand supply core problems, while the sand blasting process data to achieve a comprehensive data control and monitoring, the establishment of the field of successful experience, the successful development of the rotary table, conveyor type and robotic sand blasting equipment, series of We have successfully developed rotary table type, conveyor type and robot sand blasting equipments, and the series of equipments, after realising the standardized design and mass production, have broken through the technological blockade and high price constraints of Japan, Korea, Europe and the United States at one stroke, and have established a great advantage over the same kind of products.
The main technical features of the semiconductor material table series sand blasting equipment are as follows:
1、It realises that the spray gun can be uniformly and stably blasted under any pressure working condition of 0.1-0.6MPa, and it realises the data-based control and adjustment of the amount of abrasive discharged;
2. The continuous and stable operation of the abrasive recycling and separation system and the maximum saving of ultra-fine abrasive are realised;
3、All sand blasting parameters (air pressure, abrasive flow, spray gun and workpiece movement) are data-adjusted and controlled during operation;
4、Series of sand blasting equipment models to achieve standardised mass production, the cost has been greatly controlled.